LOCTITE HY 4070 CR11G AU 11 g Henkel — Hillcock Industrial Skip to content
LOCTITE HY 4070 CR11G AU 11 g

LOCTITE HY 4070 CR11G AU 11 g

by Henkel
SKU I-132916
MFR HY-4070-11G/LOCTITE

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Availability:
Out of stock
Application method Dispense system
Applications Bonding dissimilar materials, Bonding plastic, Bonding rubber, Construction, Direct bonding, Edge bonding, Interior repairs, Structural bonding
Cure type Room temperature (ambient) cure, Two component mix
FEA (finite element analysis) Finite strain, Viscoelastic
Fixture time, Aluminium (etched) 0.5mm gap <60.0 sec.
Gap fill 5.0 mm
Mix ratio, by volume 10 : 1
Number of components 2 part
Physical form Gel
Recommended for use with Composite, Composite: advanced composites, Dry surface, Elastomer: highly filled elastomer, Epoxy, Fiberboard, Gel coat, Laminate, Metal, Non-gel coat, Painted surface, Phenolic, Plastic, Rubber, Thermoplastic, Thermoset, Urethane: cast urethane, Vinyl, Wood
Shear strength, Steel (grit blasted) 25.0 N/mm² (3625.0 psi )
Mixed
Key characteristics, Mixed Cure speed: ultra fast cure, Gap filling, Moisture resistant, Multipurpose
Operating temperature, Mixed -40.0 - 100.0 °C (-40.0 - 212.0 °F )
Resin
Casson viscosity, cone & plate, Resin @ 25.0 °C 200.0 - 1300.0 mPa·s (cP)
Colour, Resin Yellow
Hardener
Colour, Hardener Clear
Viscosity, cone & plate, Hardener @ 25.0 °C Shear Rate 1,000 s’»¹ 1.0 - 30.0 mPa·s (cP)
LOCTITE HY 4070 is a 2-component, fast fixturing, cyanoacrylate/acrylic hybrid adhesive that works well on various substrates including most plastics, rubbers and metals. LOCTITE® HY 4070 Universal Bonder is designed for the assembly of parts with bond gaps up to 0.2 in (5 mm), and/or for applications where the complete cure of excess adhesive is a must. The gel consistency prevents adhesive flow even on vertical surfaces. HY 4070 is ideally suited for applications where temperature and moisture resistance is required. Best application results are achieved with use of the LOCTITE cyanoacrylate mixing nozzle (contained in the 11 gram kit).
  • Fast fixturing
  • Moisture resistant
  • Temperature resistance from -40 to +100°C
  • Gap filling up to 5 mm
  • Gel consistency prevents adhesive flow, even on vertical surfaces.
  • Excellent bonding characteristics to a variety of substrates including plastics, rubbers, and metals